7:02 AM
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Intel Corporation announced it has entered
into a strategic agreement with Rockchip to expand the breadth of and
accelerate the rate at which it brings its Intel® architecture and
communications-based solutions to market for a range of entry-level
Android* tablets worldwide.
Under the terms of the agreement, the two companies
will deliver an Intel-branded mobile SoC platform. The quad-core
platform will be based on an Intel® Atom™ processor core integrated with
Intel’s 3G modem technology.
Expanding the offerings in Intel’s SoFIA family of
integrated mobile SoC platforms for entry and value Android mobile
devices, the new quad-core SoFIA 3G part is expected to be available in
the first half of 2015. It will be targeted primarily at entry and value
tablets. The Intel SoFIA family was added to Intel’s mobile product
roadmap late last year and includes Intel’s first integrated
applications processor and communications platform.
As the tablet market continues to expand with
greater choice of screen size, form factor and price, the strategic
agreement with Rockchip also enables Intel to ramp new customers with a
broader portfolio of products faster.
"The
strategic agreement with Rockchip is an example of Intel’s commitment
to take pragmatic and different approaches to grow our presence in the
global mobile market by more quickly delivering a broader portfolio of
Intel architecture and communications technology solutions,” said Brian
Krzanich, Intel CEO. “We are excited to work with Rockchip. With today’s
announcement we’ve added yet another derivative to the Intel SoFIA
family, and we expect to have them all in market before the middle of
2015. We are moving with velocity to grow Intel’s offerings for the
growing global tablet market.”
The strategic agreement with Intel expands
Rockchip’s product portfolio with the addition of the performance and
flexibility of the Intel architecture and leading communications
solutions.
"We
are always looking for innovative ways to differentiate our product
portfolio, and the first-of-its-kind collaboration with Intel helps us
do this,” said Min Li, Rockchip CEO. “The combination of Intel’s leading
architecture and modem technology with our leading mobile design
capability brings greater choice to the growing global market for mobile
devices in the entry and value segments.”
With today’s announcement, the Intel SoFIA family
is now made up of three different offerings, including the dual-core 3G
version expected to ship in the fourth quarter of this year, the
quad-core 3G version that is expected to ship in the first half of 2015,
and the LTE version, also due in the first half of next year.
Pricing for the quad-core SoFIA 3G part will be
disclosed at a later date, and like the broader Intel SoFIA family, it
is expected to be price competitive. Under the agreement, both Intel and
Rockchip will sell the new part to OEMs and ODMs, primarily into each
company’s existing customer base.
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